📄 Resume

Embedded Hardware Engineer Resume

Focus: Embedded Hardware Engineer / Hardware system Engineer (Intern) | Location: Open

Basic Information

Education

2023.9 - 2027.6 | Changchun University of Science and Technology | Electronic Information Engineering (Bachelor's) Core courses: Detection Technology & Sensors (94), Digital Circuit Course Design (90), Electronic Circuit Course Design (90), Computer Fundamentals & C Programming Lab (90), Digital Measurement Technology (87), Circuit Analysis (82), Object-Oriented Programming (83), Electronic System Comprehensive Design (90)

Project Experience

1. Brushless FOC Driver Design Based on GaN Technology and ARM-M4 Platform

Project Duration: 2025.6 – 2026.8 Summary: Leveraging third-generation GaN semiconductor technology for high-precision motor control in robotic joint applications, using GaN half-bridge drivers and a Cortex-M4 high-performance platform to implement sensored/sensorless FOC control. Responsibilities: Led overall project design, hardware selection, topology design and PCB layout, bare-metal embedded software development and RTOS migration, power half-bridge hardware topology and MCU peripheral scheme design. Optimizations: Compact QFN packaging replacing SOT, reducing PCB area by 30%; four-layer PCB design ensuring impedance continuity for signal return paths; optimized FOC algorithm improving three-loop response speed and stability. Result: Achieved stable 20 kHz current loop operation, CAN/USART verified communication, and multi-device serial bus communication for high-precision motor control scenarios.

2. Autonomous Pathfinding Laser Targeting Vehicle Based on TI MSPM0G

Project Duration: 2025 (National Undergraduate Electronic Design Contest, TI Cup, Problem E) Summary: Designed and built an intelligent vehicle based on the TI MSPM0G microcontroller capable of autonomous line-following, lap counting, position setting, and laser targeting at 0.25m–1m range via host-computer communication. Responsibilities: Hardware planning and component selection, 3D model design and fabrication (3ds Max), TI MSPM0G embedded system development, soldering and debugging of embedded systems and chassis motion structure driver design, dual 42-step motor differential PID control with lap counting, angle control, branch prediction, and startup modes. Built path setting logic and Linux host communication link. Result: Scored 104/120, won Provincial First Prize.

3. Personal Audiovisual System Based on RK3568 and TI High-Performance Analog Devices

Project Duration: 2026.4 – Present Summary: A full-stack personal project based on an embedded Linux main controller (RK3568), combining digital and analog sections to build a high-quality audiovisual system. Leveraging embedded Linux flexibility and TI OPA1612, TPA6120, TPS7A, and other high-performance, low-noise analog devices to implement HiFi-grade driver circuits. Responsibilities: Full-stack engineering — schematic design, six-layer PCB layout, DTS device driver development, soldering and debugging, using Cadence Allegro and LCSC EDA. Optimizations: Analog devices use SMD packages for improved noise immunity and loop optimization; schematics adjusted per chip Application Notes & Design Guides for peripheral routing and impedance control; strict ferrite bead / 0Ω isolation between digital and analog sections; optimized layer stack-up to avoid cross-splitting; high-speed DDR routing with ground shielding and via inspection. Future Plans: Deploy lightweight AI tools at the software level; implement wireless/wired host communication as a practical assistant tool.

4. Deep Learning-Based Hexapod Robot Research

Project Duration: 2024.6 – 2025.6 Summary: Developed an autonomous patrol hexapod robot integrating embedded processors with YOLOv8n offline AI image recognition and autonomous decision-making for complex campus scenarios. Responsibilities: Low-level power hardware circuit design, embedded control scheme architecture, mechanical model design and fabrication, Linux host AI environment deployment and debugging. Optimizations: Reduced total system power consumption to 80% of the original design; optimized AI inference from 50ms to 40ms, improving robot response speed. Result: Achieved autonomous patrol, environmental recognition, and sampling in campus environments. Won ICAN National Third Prize.

Skills & Expertise

Full-Stack Design: Proficient in hardware selection and package advantages, schematic drawing, bilingual (CN/EN) datasheet analysis, PCB layout design, embedded system development and debugging. End-to-end project execution from hardware design to software development.
Instrument Operation: Skilled with oscilloscopes, signal generators, programmable DC power supplies, electronic loads, digital benchtop/handheld multimeters, and other professional test instruments for efficient hardware debugging.
Chip Development: Experienced with TI MSP, STM32, FPGA, FPGA-ARM heterogeneous chips, and RISC-V chips. Extensive MCU development across STM32, TI-MSP, GD32F450, AGM-AG32, Pango PG2H200 FPGA platforms.
Welding and Debugging: Experienced in hand soldering and repairing SMD circuits, skilled in manual soldering, replacement, and touch-up of mainstream SMD packages like QFN, QFP, and SOP, and capable of independently handling soldering and engineering debugging of high-density PCBs.
Tool Proficiency: Proficient with Altium Designer, LCSC EDA, Keil, VSCode, ARM-GCC toolchain configuration and debugging; skilled in 3ds Max modeling and FDM/SLA 3D printing for rapid product prototyping.
Continuous Learning: Constantly exploring emerging technologies and deploying production environments. Leveraging AI tools effectively. Conducted research in department head's lab throughout undergraduate studies.
Competition Experience: Multiple national and provincial competition awards, frequently serving as project lead or core member with strong problem-solving, teamwork, and project management capabilities.

Awards & Honors

2025: National Undergraduate Electronic Design Contest (TI Cup) — Provincial First Prize
2025: National Undergraduate Intelligent Car Competition — National Third Prize
2025: ICAN Innovation & Entrepreneurship Competition — National Third Prize
2025: National Computer Rank Certificate (Level 3 — Embedded System Development Technology)
2025: National Undergraduate Engineering Practice & Innovation Competition — Provincial First Prize
2024/2025: National Undergraduate Innovation & Entrepreneurship Competition (Lead, 2 sessions) — Provincial Level Completion
2026: National Undergraduate Mechanical Design & Innovation Competition — Provincial Second Prize
2025: Siemens Cup Intelligent Manufacturing Challenge — Provincial Second Prize
2025: National Undergraduate Integrated Circuit & Innovation Competition — Provincial Second Prize